Product Overview
Our surface grinding machines provide advanced solutions for precision flat surface finishing. These machines combine cutting-edge technology and efficiency, ensuring high precision and quality in surface grinding operations. They are designed to handle various material types and surface sizes, making them versatile for a range of industrial applications, from automotive to tool manufacturing.
Product Features Of Surface Grinding Machine
Intelligent temperature compensation: built-in 16-point thermal deformation monitoring system to eliminate precision drift caused by ambient temperature difference (fluctuation ≤ 2μm/8h).
High-speed hydraulic drive: the workbench adopts linear guide + static pressure technology, with stepless speed regulation of 5-25m/min (vibration value < 0.5μm).
Intelligent grinding wheel library: equipped with 24-station automatic wheel changing system, supporting 10-second fast switching of diamond/CBN/ceramic grinding wheels.
Multi-axis CNC system: equipped with Siemens 840D sl controller, supporting 3D surface grinding programming (minimum feed amount 0.1μm).
Cloud diagnosis platform: remote optimization of grinding parameters and fault prediction through OPC UA protocol.
Product Advantages Of Surface Grinding Machine
Efficiency leap: 60% shorter than traditional surface grinding processing cycle, CPK value stable above 1.65.
Energy saving and consumption reduction: equipped with energy feedback system, comprehensive energy consumption is reduced by 30% (in line with ISO 50001 standard).
Technology innovation: supports wet/dry processing mode switching, reducing cutting fluid consumption by 85%.
Accuracy assurance: laser interferometer is used for periodic calibration to ensure that the annual accuracy attenuation rate of the equipment is less than 0.003mm.
Product Applications Of Surface Grinding Machine
Automotive mold: engine cylinder flatness repair (flatness 0.005mm/m²).
Optical device: sapphire light guide plate nano-level polishing (Ra 0.02μm).
Aerospace: titanium alloy wing skin positioning surface precision machining (parallelism 0.003mm).
Semiconductor equipment: vacuum cavity sealing surface ultra-fine grinding (plane waviness ≤0.1μm).
